Sputtering • Isotropic nature • Primarily neutral atoms • Void formation for deposition into deep aspect ratio features • Trajectory cannot be influenced
Solution: • Ionized PVD (i-PVD)
Copper deposition into low aspect structures by collimated magnetron sputtering
© TUD
First results using Fraunhofer pulsed arc source (HCA)
© FhG IWS
First tests in conformal coverage using the HCA-source
© FhG IWS
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