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Sputtering
 •   Isotropic nature
 •   Primarily neutral atoms
 •   Void formation for deposition into deep aspect ratio features
 •   Trajectory cannot be influenced

Solution:
 •   Ionized PVD (i-PVD)




Copper
deposition
into
low aspect
structures by
collimated
magnetron
sputtering











© TUD




First results
using Fraunhofer
pulsed arc
source (HCA)










© FhG IWS
 




First tests
in conformal
coverage
using the
HCA-source








© FhG IWS

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